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XC3588BB Development Evaluation Board

This intelligent development board uses the new generation flagship chip RK3588, featuring an octa-core 64-bit big.LITTLE architecture with 4 Cortex-A76 cores and 4 Cortex-A55 cores; main frequency of 2.4GHz, advanced 8nm process, high performance, low power consumption, GPU: Mali-G610 MC4, dedicated 2D graphics acceleration module; 6TOPS AI computing power, tri-core architecture, 8K video encoding and decoding, 8K display output, rich expansion interfaces. B2B connector design provides reference circuit and technical support, supporting multiple operating systems.
  • Product Description
  • Core Parameters
    CPURK3588 64-bit Octa-core 4*Cortex-A76 + 4*Cortex-A55
    GPUMali-G610 MC4
    MemoryLPDDR4 standard 4G (8G optional)
    StorageEMMC standard 32G (32G/64G/128G optional)
    Network Interface
    4G/5G

    Supports 4G/5G network (optional data module);

    MINI-PCIE interface optional, default PCIE

    5G Communication InterfaceM.2 PCIE-B.KEY (NGFF interface)
    BluetoothBT5.0 (optional)
    SIM Card SlotMICRO-SIM card slot, medium card
    Audio Interface
    Audio3.5MM audio output/MIC input
    SpeakerSupports 5W/8Ω*2
    Display Interface
    HDMI OUT1 HDMI OUT supporting 4k/60FPS audio and video HD output
    HDMI IN1 HDMI IN 1080p@60HZ
    EDPSupports EDP 1.3, resolution up to 2560×1600@60Hz
    BLBacklight *2 channels (PWM controllable)
    Mipi-CsiSupports camera input
    Peripheral Interface
    Power1 external DC12V input socket (DC-5.5*2.0MM female), 1 2.54mm-4P socket, recommended input 12V/3A
    USB2.04 USB2.0 HOST ports
    Serial Port (485)1 channel (UART2)
    Hard Disk InterfaceM.2 PCIE-M.KEY (NVME interface)
    TP/IICSupports 7bits and 10bits address modes, maximum speed up to 1 Mbit/s
    PCIE3.0

    PCIe 3.0, 1×2Lanes or 2×1Lane, maximum speed per lane 8.0Gbps

    1Lane supports Root Complex (RC) mode only

    2Lanes support Root Complex (RC) and End Point (EP) modes

    PCIe2.1PCIe 2.1 x1, maximum speed 5.0Gbps, RC mode
    Operating SystemAndroid 12, Ubuntu 20.04, Kirin V10 SP1/Starlight Kirin
    PCB8-layer immersion gold process
    Operating Temperature-20 to 60 degrees Celsius
    Storage Temperature-40 to 85 degrees Celsius

     

    Rich Expansion Interfaces

     

    Development Materials

     

    Application Scenarios

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