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  • XN3288_V1.jpg

XN3288 Industrial Control Motherboard

This product features the flagship RK3288 quad-core Cortex‑A17 processor, with a clock speed of up to 1.8 GHz; it offers a wealth of peripheral functions, highly integrated interfaces, and supports multi-display output.
  • Product Description
  • Core Parameters

    CPU

    Quad-core Cortex-A17, with a maximum clock speed of 1.8 GHz.

    Memory

    DDR3: 2G

    Storage

    eMMC: 8 GB (customizable to 16 GB / 32 GB / 64 GB)
    Network interface

    Wired network

    Single-port Ethernet 1000 Mbps

    Wireless network

    Supports Wi‑Fi and Bluetooth; dual-band Wi‑Fi 2.4/5 GHz.

    Bluetooth

    BT 4.0 (Wi‑Fi and Bluetooth all-in-one)

    3G/4G

    Support 3 G /4G Network (optional data module) MINI - PCIe Interface optional; default is PCIe.

    SIM card slot

    Micro-SIM card slot, mid-size card
    Audio interface

    Audio

    3.5mm Audio Output/Microphone Input

    Horn

    4-pin 2.0 socket, left–right stereo output, dual speakers: 4 Ω at 15 W or 8 Ω at 10 W.
    Display interface

    LVDS/RGB

    1 unit, dual‑lane LVDS interface, supporting up to 1920×1080 output.

    BL

    Backlight * 1 channel (PWM controllable)

    HDMI OUT

    HDMI supports 4K/60PFS high-definition audio and video output.

    Mipi-Dsi

    1 MIPI-DSI-40PIN-FPC, supporting up to 1200×1920 output.
    Peripheral interface

    Power supply

    1 external DC 12V input jack (DC-5.5×2.0 mm female connector)

    USB2.0

    8-way USB HOST

    Serial Port (TTL)

    Channel 3 (UART0, 2, 4 by default, TTL), voltage 3.3 V

    Serial port (232)

    Channel 2 (UART1,3 by default, RS-232), voltage 3.3 V

    TP/IIC

    Route 1, providing an 8-pin PH2.0 socket.

    Real-Time Clock

    Supports a real-time clock, powered by a button cell battery.

    Button

    UBOOT RESET

    Expand IO

    A total of 4 channels (PH2.0-6PIN), supporting both input and output operation (default voltage: 3.3V; can be switched to 5V).

    KEY

    XH2.0-5P; External interfaces: RECOVER, POWER, RESET

    PCB

    6-layer immersion gold process

    Operating temperature

    0~65 degrees Celsius

    Storage temperature

    -40~85 degrees Celsius

    Rich expansion interfaces

     

    Open Data

     

    Application scenarios

Keywords

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